Special Articles: Plating for Printed Wiring Boards. Chemistry of Gold Plating.
نویسندگان
چکیده
منابع مشابه
Interconnection Evaluation Technology for Printed Wiring Boards
As a developer of world-class products including server and network devices, Fujitsu recognizes the printed wiring board (PWB) as a core component among the various components of those products. One basic element supporting high-quality PWBs is through-hole interconnection reliability. Existing methods for evaluating interconnections typically involve temperature cycle tests that subject the PW...
متن کاملGalvanic gold plating for fixed dental prosthesis
Metal ceramic partial fixed dental prostheses have been commonly used for the replacement of missing teeth for many years. Because of an increase in the price of gold, base metal alloys have been the choice of alloy for the fabrication of metal ceramic restorations in many dental clinics. Some major disadvantages of base metals are their corrosion and the dark coloration they may cause at the c...
متن کاملMultichannel plating unit for high-throughput plating of cell cultures.
High-throughput genomic approaches to gene function or target identification have led to the development and implementation of the 96-well format for many standard molecular biology manipulations. The apparatus described here, a Multichannel Plating Unit, is designed to plate out individual cultures efficientlyfrom standard 96-well culture blocks. Following transformation, aliquots of culture a...
متن کاملEstimating the Effects of Gold Plating Using Fuzzy Cognitive Maps
The systems and software development industry is characterized by a paradigm of project failure. There are various factors that can lead to project failure .One such factor is gold plating. Gold plating can cause various problems in the projects like increase in project complexity, use of more resources, and increase in time and budget of the project and many more. If effects of gold plating ar...
متن کاملPlating Hydrogen
Cathodic activation examined with reference to the cold fuslon developments (controversy). Historically cathodic activation has been used for plating preparation of p a s s i v e (o x i d e) s u r f a c e s e.g. nickel/chromium alloys, niobium and powdered metals. More recent results of work employing cathodic activation for preparing aluminum for plating will be presented e.g. process paramete...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Circuit Technology
سال: 1993
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.8.368